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![Eng Sub] Flipchip die attach process: Bump, MR(Mass Reflow), TCNCP, LAB(Laser Assist Bond), NCP - YouTube](https://i.ytimg.com/vi/Yr_1vcYdbvI/maxresdefault.jpg "Eng Sub] Flipchip die attach process: Bump, MR(Mass Reflow), TCNCP, LAB(Laser Assist Bond), NCP - YouTube")